Open Science Research Excellence

ICTMP 2020 : International Conference on Thermoforming Methods and Processes

New York, USA
January 30 - 31, 2020

Call for Papers

ICTMP 2020 : International Conference on Thermoforming Methods and Processes is the premier interdisciplinary platform for the presentation of new advances and research results in the fields of Thermoforming Methods and Processes. The conference will bring together leading academic scientists, researchers and scholars in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:
  • Thermoforming and thermoforming process
  • Manufacturing and design
  • Industrial engineering
  • Thermoforming methods
  • Thermoforming design
  • Thermoplastic behavior
  • Heating and cooling
  • Thin-gauge and heavy-gauge thermoforming
  • Thermoforming mold making
  • Vacuum thermoforming
  • Pressure thermoforming
  • Mechanical thermoforming
  • Thermoforming applications
  • Plastic fabrication in thermoforming
  • Computational thermoforming and digital fabrication