Open Science Research Excellence

ICEET 2020 : International Conference on Electronic Encapsulation Technologies

Istanbul, Turkey
April 24 - 25, 2020

Call for Papers

ICEET 2020 : International Conference on Electronic Encapsulation Technologies is the premier interdisciplinary platform for the presentation of new advances and research results in the fields of Electronic Encapsulation Technologies. The conference will bring together leading academic scientists, researchers and scholars in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:
  • Encapsulation technologies for electronic applications
  • Electronic packaging
  • Encapsulated microelectronic packages
  • Plastic encapsulation methods and encapsulant materials
  • Market conditions and manufacturers of encapsulant materials
  • Environmentally friendly or green encapsulants
  • Encapsulation process technology
  • Printing encapsulation technology
  • Characterization of encapsulant properties
  • Encapsulation defects and failures
  • Electronic equipment packaging
  • Advanced packaging
  • TSV/WAFER level packaging
  • Interconnection technologies
  • Emerging packaging technologies
  • Materials and substrates/leadframes
  • Processes and automation/equipments
  • Electrical modeling and simulations
  • Mechanical modeling and simulations
  • Thermal characterization and cooling solutions
  • Quality and reliability
  • Sheet metal
  • Cast metal
  • Machined metal
  • Molded plastic
  • Potting
  • Porosity sealing or impregnation
  • Liquid filling
  • Conformal coating
  • Glop-top
  • Hermetic metal/glass cases
  • Hermetic ceramic packages
  • Printed circuit assemblies