Open Science Research Excellence

ICMMMP 2020 : International Conference on Measuring Methods of Materials Properties

Tokyo, Japan
September 10 - 11, 2020

Call for Papers

ICMMMP 2020 : International Conference on Measuring Methods of Materials Properties is the premier interdisciplinary platform for the presentation of new advances and research results in the fields of Measuring Methods of Materials Properties. The conference will bring together leading academic scientists, researchers and scholars in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:
  • Ductility
  • Crack Resistance
  • Fatigue
  • Creep-resistance
  • Fracture Mechanics
  • Mechanical Properties
  • Electrical Properties
  • Magnetic Properties
  • Corrosion
  • Erosion
  • Wear Resistance
  • Non-Destructive Testing
  • Reliability
  • Assessment
  • Toxicity
  • Working Properties of Materials and Products
  • Large Scale Applications
  • Electronics Applications