Open Science Research Excellence

ICEST 2021 : International Conference on Electronic Soldering Technology

London, United Kingdom
January 21 - 22, 2021

Call for Papers

ICEST 2021 : International Conference on Electronic Soldering Technology is the premier interdisciplinary platform for the presentation of new advances and research results in the fields of Electronic Soldering Technology. The conference will bring together leading academic scientists, researchers and scholars in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:
  • Soldering science and technology
  • Soldering and surface mount technology
  • Novel soldering processes and new solder alloys
  • Surface mount technology (SMT)
  • Surface mount assembly
  • Advanced packaging technologies and 3D interconnects
  • Flip chip/BGA/SiP/TSV
  • Novel substrates and embedded components
  • Solderable finishes and coatings
  • Screen printing
  • Conductive adhesives and conformal coatings
  • Reliability
  • Quality control
  • Inspection and testing
  • Rework and repair
  • Environmental aspects