Open Science Research Excellence

ICTEEID 2021 : International Conference on Tangible, Embedded and Embodied Interaction Design

Tokyo, Japan
September 9 - 10, 2021

International Scientific Committee

Firas Al-Laban   Qatar University, QA
Nitish Gupta   Tokyo Institute of Technology, JP
Karolina Nurzynska   Kanazawa University, JP
Yasuhiro Takahashi   Gifu University, JP
Anjali Das   Tte Systems Ltd (spin-out Company From the University of Leicester), UK
Jia Wan   Randolph College, US
Senthil Kumar Kuppusamy   Kpit Technologies Inc, Usa, US
Aziz Fellah   Northwest Missouri State University, US
Kuldeep Rawat   Elizabeth City State University, US
Upasna Vishnoi   Marvell Semiconductor, US
Zhenyu Zhang   Western Digital Corporation, US
George Mikulski   University of Maryland, US
Apurva Mohan   Honeywell Research Labs, US
Venkatesan Muthukumar   University of Nevada Las Vegas, US
Ehsan Kamrani   Harvard Medical School, US
Mohshin Maredia   University of Houston Downtown, US
Guoxiang Liu   University of North Dakota, US
Danda Rawat   Old Dominion University, US
Jiahui Yuan   Georgia Institute of Technology, US
Yanhui Guo   Utah State University, US
Todd Wey   Lafayette College, US
Murad Al-Rajab   Bethlehem University, PS
Renjith V Ravi   Mea Engineering College, IN
Mandeep Kaur   Sharda University, IN
Katarina Rogulj   University of Split, Faculty of Civil Engineering, Architecture and Geodesy, HR
Hicham Medkour   The University Ferhat Abbas of Setif, DZ
Sonal Kapoor   Indirapuram Institute of Higher Studies (iihs), IN
Sajjad Ahmed   University of Camerino, IT
Arafat Aldhaqm   University of Technology, Malaysia, MY
Hlaing Htake Khaung Tin Hhkt   University of Computer Studies, Yangon, MM
Mohcine Kodad   University Mohammed First, MA
Vijay Velmurugan   Jamal Mohamed College, IN
A.devi Arumugam   Ifet College of Engineering, IN
Ayad Abdulkafi   University of Tikrit, IQ
Zuherman Rustam   University of Indonesia, ID