Open Science Research Excellence

ICMNN 2024 : International Conference on Microelectronics, Nanoelectronics and Nanoengineering

Berlin, Germany
May 20 - 21, 2024

Call for Papers

ICMNN 2024 : International Conference on Microelectronics, Nanoelectronics and Nanoengineering is the premier interdisciplinary platform for the presentation of new advances and research results in the fields of Microelectronics, Nanoelectronics and Nanoengineering. The conference will bring together leading academic scientists, researchers and scholars in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:
  • Bio-nanotechnology & hybrid bio/solid state devices
  • Device characterization and modelling
  • Device physics and novel structures
  • DUV, immersion, EUV and X-ray lithography
  • DUV, VUV, EUV Lithography and Metrology
  • Electron and Ion Beam Lithography
  • Lithography and Related Technologies
  • Maskless Lithography
  • MEMS and Nanoelectronic Devices
  • Metrology and alignment
  • Micro and nano-scaled MEMS
  • Microelectronic Circuit Design
  • Microelectronic Device Electrical and Reliability Testing
  • Microelectronic Device Processing and Process Integration
  • Microsystem Technology and MEMS
  • Molecular and low-dimensional nano-electronics
  • Nanodevices
  • Nanoelectronics
  • Nanofabrication for energy sources
  • Nano-fabrication techniques
  • Nanoimprint lithography, embossing and soft lithography
  • Nanoimprint, Nanoprint and Rising Lithography
  • Nanomagnetic devices
  • Nanomaterials
  • Nanometer scale photonic devices
  • Nanoparticle synthesis and assembly
  • Nano-particle, synthesis and assembly
  • Nanotechnology
  • Nano-Tools
  • Novel ultrahigh density data storage devices
  • Optoelectronics
  • Optical tweezers
  • Packaging and surface mount technology
  • Photon- and charged-particle optics
  • Plasma etching and deposition
  • Reliability and failure analysis
  • Resist Materials and Processing
  • Resists and resist processing
  • Self-assembly and directed self-assembly
  • Semiconductor Packaging and Reliability
  • Silicon optimization
  • Simulation and computer aided design for the Nanoscale Era
  • Sub-half wavelength "super resolution" optical lithography