Open Science Research Excellence

ICTMP 2020 : 22nd International Conference on Thermoforming Methods and Processes

January 30 - 31, 2020
New York, USA
Discipline Industrial and Manufacturing Engineering
Subdiscipline Thermoforming Methods and Processes
Event Type Conference
Delegate Fee 250euro-500euro

Conference Aims and Objectives

The ICTMP 2020: 22nd International Conference on Thermoforming Methods and Processes aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Thermoforming Methods and Processes. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Thermoforming Methods and Processes.

Call for Contributions

All honorable authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Thermoforming Methods and Processes are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.