Open Science Research Excellence

ICSMP 2021 : 23rd International Conference on Smart Materials and Piezomagnetics

May 27 - 28, 2021
Tokyo, Japan
For direction to the venue you can use google maps.
Discipline Materials and Metallurgical Engineering
Subdiscipline Smart Materials and Piezomagnetics
Event Type Conference
Delegate Fee 250euro-500euro

Conference Aims and Objectives

The ICSMP 2021: 23rd International Conference on Smart Materials and Piezomagnetics aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Smart Materials and Piezomagnetics. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Smart Materials and Piezomagnetics.

Call for Contributions

All honorable authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Smart Materials and Piezomagnetics are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.