Discipline Computer and Information Engineering
Subdiscipline Tangible, Embedded and Embodied Interaction Design
Event Type Conference
Delegate Fee 250euro-500euro
Conference Aims and Objectives
The ICTEEID 2021: 23rd International Conference on Tangible, Embedded and Embodied Interaction Design aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Tangible, Embedded and Embodied Interaction Design. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Tangible, Embedded and Embodied Interaction Design.
Call for Contributions
All honorable authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Tangible, Embedded and Embodied Interaction Design are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.